Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10477729 | Receptacle assembly and thermal-transfer assembly | Jiwang Jin, Wenyu Liu, Nikhil Shankar, Alex Michael Sharf, Chenxi Wang | 2019-11-12 |
| 10177474 | Connector and connector assembly | Hongwen Yang, Wenyu Liu, Jiwang Jin | 2019-01-08 |