Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10477729 | Receptacle assembly and thermal-transfer assembly | Hongqiang Han, Jiwang Jin, Wenyu Liu, Nikhil Shankar, Alex Michael Sharf | 2019-11-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10477729 | Receptacle assembly and thermal-transfer assembly | Hongqiang Han, Jiwang Jin, Wenyu Liu, Nikhil Shankar, Alex Michael Sharf | 2019-11-12 |