Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10256202 | Durable bond pad structure for electrical connection to extreme environment microelectronic integrated circuits | David J. Spry, Philip G. Neudeck, Carl Chang, Liangyu Chen, Roger D. Meredith +5 more | 2019-04-09 |