Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490550 | Larger-area integrated electrical metallization dielectric structures with stress-managed unit cells for more capable extreme environment semiconductor electronics | Philip G. Neudeck | 2019-11-26 |
| 10256202 | Durable bond pad structure for electrical connection to extreme environment microelectronic integrated circuits | Dorothy Lukco, Philip G. Neudeck, Carl Chang, Liangyu Chen, Roger D. Meredith +5 more | 2019-04-09 |