Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10518490 | Methods and systems for embedding filaments in 3D structures, structural components, and structural electronic, electromagnetic and electromechanical components/devices | Ryan Wicker, Eric MacDonald, Danny W. Muse, David Espalin | 2019-12-31 |
| 10335673 | Electronic gaming die | Danny W. Muse, Ryan Wicker, Eric MacDonald, Rodolfo Salas | 2019-07-02 |