Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10518490 | Methods and systems for embedding filaments in 3D structures, structural components, and structural electronic, electromagnetic and electromechanical components/devices | Ryan Wicker, Francisco Medina, Danny W. Muse, David Espalin | 2019-12-31 |
| 10464306 | Metal objects spanning internal cavities in structures fabricated by additive manufacturing | Ryan Wicker, David Espalin | 2019-11-05 |
| 10335673 | Electronic gaming die | Danny W. Muse, Ryan Wicker, Rodolfo Salas, Francisco Medina | 2019-07-02 |
| 10259081 | Connecting metal foils/wires and components in 3D printed substrates with wire bonding | David Espalin, Ryan Wicker | 2019-04-16 |