Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10229868 | Method of making a wire support leadframe for a semiconductor device | Yuh-Harng Chien, Chih-Chien Ho | 2019-03-12 |
| 10211132 | Packaged semiconductor device having multi-level leadframes configured as modules | Chia-Yu Chang, Chih-Chien Ho | 2019-02-19 |