Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10395971 | Dam laminate isolation substrate | Chang-Yen Ko, Chung Ming Cheng, Megan Chang | 2019-08-27 |
| 10229868 | Method of making a wire support leadframe for a semiconductor device | Yuh-Harng Chien, Steven Su | 2019-03-12 |
| 10211132 | Packaged semiconductor device having multi-level leadframes configured as modules | Chia-Yu Chang, Steven Su | 2019-02-19 |