Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497643 | Patterned die pad for packaged vertical semiconductor devices | Manu J. Prakuzhy | 2019-12-03 |
| 10446414 | Semiconductor package with filler particles in a mold compound | Amit Sureshkumar Nangia, Janakiraman Seetharaman | 2019-10-15 |
| 10204842 | Semiconductor package with a wire bond mesh | Amit Sureshkumar Nangia | 2019-02-12 |