Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446414 | Semiconductor package with filler particles in a mold compound | Siva Prakash Gurrum, Janakiraman Seetharaman | 2019-10-15 |
| 10204842 | Semiconductor package with a wire bond mesh | Siva Prakash Gurrum | 2019-02-12 |