Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10418320 | Structure and method for improving high voltage breakdown reliability of a microelectronic device | Byron Lovell Williams, David Leonard Larkin, Weidong Tian | 2019-09-17 |
| 10366958 | Wire bonding between isolation capacitors for multichip modules | Thomas D. Bonifield, Byron Lovell Williams | 2019-07-30 |