Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10426032 | Multilayer wiring structure and its manufacturing method | Hajime Kuwajima, Tomonaga Nishikawa, Takashi Ohtsuka, Takeshi Oohashi, Manabu Yamatani | 2019-09-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10426032 | Multilayer wiring structure and its manufacturing method | Hajime Kuwajima, Tomonaga Nishikawa, Takashi Ohtsuka, Takeshi Oohashi, Manabu Yamatani | 2019-09-24 |