Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10426032 | Multilayer wiring structure and its manufacturing method | Hajime Kuwajima, Takashi Ohtsuka, Takeshi Oohashi, Yuichiro Okuyama, Manabu Yamatani | 2019-09-24 |
| 10418164 | Coil component, manufacturing method thereof, and circuit board on which coil component are mounted | Tomokazu Ito, Takeshi Okumura, Kouji Kawamura, Tadashi Watanabe, Hidenori TSUTSUI | 2019-09-17 |