Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10366963 | Noble metal paste for bonding of semiconductor element | Masayuki Miyairi, Nobuyuki Akiyama, Katsuji Inagaki | 2019-07-30 |
| 10256113 | Transfer substrate for forming metal wiring and method for forming metal wiring with the transfer substrate | Masaaki Kurita, Takashi Nishimori, Yukio Kanehira | 2019-04-09 |