Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10256113 | Transfer substrate for forming metal wiring and method for forming metal wiring with the transfer substrate | Toshinori Ogashiwa, Masaaki Kurita, Yukio Kanehira | 2019-04-09 |