Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475742 | Method for forming semiconductor device structure having conductive structure with twin boundaries | Jian-Hong Lin, Chwei-Ching Chiu, Chien-Neng Liao, Yu-Lun Chueh, Tsung-Cheng CHAN +1 more | 2019-11-12 |
| 10431541 | Semiconductor device, layout pattern and method for manufacturing an integrated circuit | Jian-Hong Lin, Hsin Chang, Hui Yu Lee, Yung-Sheng Huang | 2019-10-01 |
| 10283450 | Method for forming semiconductor device structure having conductive structure with twin boundaries | Jian-Hong Lin, Chwei-Ching Chiu, Chien-Neng Liao, Yu-Lun Chueh, Tsung-Cheng CHAN +1 more | 2019-05-07 |