Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475742 | Method for forming semiconductor device structure having conductive structure with twin boundaries | Jian-Hong Lin, Chwei-Ching Chiu, Yung-Huei Lee, Chien-Neng Liao, Yu-Lun Chueh +1 more | 2019-11-12 |
| 10283450 | Method for forming semiconductor device structure having conductive structure with twin boundaries | Jian-Hong Lin, Chwei-Ching Chiu, Yung-Huei Lee, Chien-Neng Liao, Yu-Lun Chueh +1 more | 2019-05-07 |