Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10177038 | Prevention of contact bottom void in semiconductor fabrication | Chung-Ting Ko, Chen-Ming Lee, Mei-Yun Wang, Fu-Kai Yang | 2019-01-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10177038 | Prevention of contact bottom void in semiconductor fabrication | Chung-Ting Ko, Chen-Ming Lee, Mei-Yun Wang, Fu-Kai Yang | 2019-01-08 |