Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515989 | Device comprising photodiode and method of making the same | Chia-Chan Chen, Ta-Hsin Chen, Shih-Hsien Huang, Chih-Huang Li | 2019-12-24 |
| 10510606 | Protected chip-scale package (CSP) pad structure | Chia-Chan Chen, Ching-Heng Liu | 2019-12-17 |
| 10276441 | Protected chip-scale package (CSP) pad structure | Chia-Chan Chen, Ching-Heng Liu | 2019-04-30 |
| 10276524 | Bond pad structure for bonding improvement | Chia-Chan Chen | 2019-04-30 |
| 10170517 | Method for forming image sensor device | Ta-Hsin Chen, Chia-Chan Chen, Chih-Huang Li, Ren-Jie Lin, Jung-I Lin | 2019-01-01 |