Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510606 | Protected chip-scale package (CSP) pad structure | Yueh-Chuan Lee, Chia-Chan Chen | 2019-12-17 |
| 10276441 | Protected chip-scale package (CSP) pad structure | Yueh-Chuan Lee, Chia-Chan Chen | 2019-04-30 |