YH

Yi-Ting Hu

TSMC: 1 patents #1,597 of 3,065Top 55%
📍 Budai, TW: #1 of 1 inventorsTop 100%
Overall (2019): #213,678 of 560,194Top 40%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10312118 Bonding apparatus and method Pei-Shan Wu, Ming-Tan Lee, Yu-Lin Wang, Yuh-Sen Chang, Pin-Yi Shin +3 more 2019-06-04