Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10312118 | Bonding apparatus and method | Pei-Shan Wu, Yi-Ting Hu, Ming-Tan Lee, Yu-Lin Wang, Yuh-Sen Chang +3 more | 2019-06-04 |
PS
Pin-Yi Shin
Overall (2019): #310,481 of 560,194Top 60%
1
Patents 2019