Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504847 | Chip package structure and chip package structure array | Wen-Yuan Chang, Hsueh-Chung Shelton Lu, Wei-Cheng Chen | 2019-12-10 |
| 10276664 | Semiconductor structures and methods for multi-dimension of nanowire diameter to improve drive current | Tsung-Hsing Yu, Chia-Wen Liu, Jean-Pierre Colinge | 2019-04-30 |
| 10204852 | Circuit substrate and semiconductor package structure | Chen-Yueh Kung | 2019-02-12 |