Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515817 | Method for forming features of semiconductor structure having reduced end-to-end spacing | Yun-Yu Hsieh, Cha-Hsin Chao, Li-Te Hsu | 2019-12-24 |
| 10495970 | Critical dimension uniformity | Cha-Hsin Chao, Yi-Wei Chiu, Li-Te Hsu, Chih-Hsuan Lin | 2019-12-03 |
| 10269624 | Contact plugs and methods of forming same | Y. H. Kuo, Cha-Hsin Chao, Yi-Wei Chiu, Li-Te Hsu | 2019-04-23 |
| 10199252 | Thermal pad for etch rate uniformity | Chin-Huei Chiu, Tsung Fan Yin, Chen-Yi Liu, Hua-Li Hung, Yi-Wei Chiu | 2019-02-05 |