Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453740 | Interconnect structure without barrier layer on bottom surface of via | Chien-Hsin Ho, Ming-Han Lee | 2019-10-22 |
TK
Tz-Jun Kuo
Overall (2019): #234,349 of 560,194Top 45%
1
Patents 2019