Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453740 | Interconnect structure without barrier layer on bottom surface of via | Tz-Jun Kuo, Ming-Han Lee | 2019-10-22 |
CH
Chien-Hsin Ho
Overall (2019): #513,673 of 560,194Top 95%
1
Patents 2019