Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10269586 | Package structure and methods of forming same | Bruce C. S. Chou, Chih-Hsien Lin, Hsiang-Tai Lu, Jung-Kuo Tu, Tung-Hung Hsieh +1 more | 2019-04-23 |
| 10269658 | Integrated circuit devices with well regions and methods for forming the same | Chi-Feng Huang, Chia-Chung Chen, Victor Chiang Liang | 2019-04-23 |