ML

Ming-Hsien Lin

TSMC: 2 patents #984 of 3,065Top 35%
📍 Hsinchu, WI: #2 of 3 inventorsTop 70%
Overall (2019): #139,004 of 560,194Top 25%
2
Patents 2019

Issued Patents 2019

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
10312189 Enhancing integrated circuit density with active atomic reservoir Ta-Pen Guo 2019-06-04
10170322 Atomic layer deposition based process for contact barrier layer Chung-Liang Cheng, YU-LIN LIU, Tzo-Hung Luo 2019-01-01