Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510587 | Method for manufacturing semiconductor device | Wei-Chieh Huang, Chin-Wei Liang, Feng-Jia Shiu, Hsia-Wei Chen, Ching-Sen Kuo | 2019-12-17 |
| 10439135 | VIA structure and methods of forming the same | Wei-Chieh Huang, Feng-Jia Shiu, Chern-Yow Hsu | 2019-10-08 |