GL

Geng-He Lin

TSMC: 2 patents #984 of 3,065Top 35%
Overall (2019): #171,631 of 560,194Top 35%
2
Patents 2019

Issued Patents 2019

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
10388645 Integrated circuit filler and method thereof Tseng Chin Lo, Molly Chang, Ya-Wen Tseng, Chih-Ting Sun, Zi-Kuan Li +1 more 2019-08-20
10283496 Integrated circuit filler and method thereof Tseng Chin Lo, Molly Chang, Ya-Wen Tseng, Chih-Ting Sun, Zi-Kuan Li +1 more 2019-05-07