Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10388645 | Integrated circuit filler and method thereof | Tseng Chin Lo, Ya-Wen Tseng, Chih-Ting Sun, Zi-Kuan Li, Bo-Sen Chang +1 more | 2019-08-20 |
| 10282174 | Software layout processing localization | Xiao Feng Ji, Michael R. O'Brien | 2019-05-07 |
| 10283496 | Integrated circuit filler and method thereof | Tseng Chin Lo, Ya-Wen Tseng, Chih-Ting Sun, Zi-Kuan Li, Bo-Sen Chang +1 more | 2019-05-07 |