Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522532 | Through via extending through a group III-V layer | Chia-Shiung Tsai, Shih-Chang Liu, Yung-Chang Chang | 2019-12-31 |
| 10508021 | Microelectromechanical systems (MEMS) structure to prevent stiction after a wet cleaning process | — | 2019-12-17 |
| 10509169 | Semiconductor structure and manufacturing method of the same | Yung-Chang Chang, Ming Chyi Liu, Shih-Chang Liu | 2019-12-17 |
| 10468587 | Semiconductor structure, electrode structure and method of forming the same | Fu-Ting Sung, Yao-Wen Chang, Shih-Chang Liu | 2019-11-05 |
| 10325910 | Semiconductor device containing HEMT and MISFET and method of forming the same | Sheng-De Liu, Fu-Chih Yang, Shih-Chang Liu, Chia-Shiung Tsai | 2019-06-18 |
| 10322930 | Semiconductor arrangement and formation thereof | Lee-Chuan Tseng, Chia-Shiung Tsai, Ru-Liang Lee | 2019-06-18 |
| 10269637 | Semiconductor structure and fabricating method thereof | Lee-Chuan Tseng, Lung Yuan Pan | 2019-04-23 |