Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515896 | Interconnect structure for semiconductor device and methods of fabrication thereof | Kai-Hsuan Lee, Yen-Ming Chen, Chi On Chui, Sai-Hooi Yeong | 2019-12-24 |
| 10483266 | Flexible merge scheme for source/drain epitaxy regions | Kai-Hsuan Lee, Cheng-Yu Yang, Sheng-Chen Wang, Sai-Hooi Yeong, Feng-Cheng Yang +1 more | 2019-11-19 |
| 10276693 | Semiconductor device and manufacturing method thereof | Chun-An Lin, Chun-Hsiung Lin, Sai-Hooi Yeong, Ching-Fang Huang, Wen-Hsing Hsieh | 2019-04-30 |