Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510688 | Via rail solution for high power electromigration | Kam-Tou Sio, Chih-Ming Lai, Chun-Kuang Chen, Chih-Liang Chen, Charles Chew-Yuen Young +3 more | 2019-12-17 |
| 10170422 | Power strap structure for high performance and low current density | Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Jiann-Tyng Tzeng, Kam-Tou Sio +6 more | 2019-01-01 |