Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10516027 | Trench power semiconductor and method of making the same | Chun-Ying Yeh, Yuan-Ming Lee | 2019-12-24 |
| 10497782 | Trench power semiconductor component and method of manufacturing the same | Chun-Ying Yeh, Chun-Wei Ni | 2019-12-03 |
| 10446658 | Trench power semiconductor device and manufacturing method thereof | — | 2019-10-15 |
| 10381268 | Fan-out wafer level chip package structure | Chih-Cheng Hsieh | 2019-08-13 |