Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10381268 | Fan-out wafer level chip package structure | Hsiu-Wen Hsu | 2019-08-13 |
| 10297522 | Semiconductor package structure and manufacturing method thereof | — | 2019-05-21 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10381268 | Fan-out wafer level chip package structure | Hsiu-Wen Hsu | 2019-08-13 |
| 10297522 | Semiconductor package structure and manufacturing method thereof | — | 2019-05-21 |