Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10244626 | Adhesive composition for printed wiring boards, bonding film, coverlay, copper-clad laminate and printed wiring board | Takayuki Yonezawa, Shingo Kaimori, Jun Sugawara, Yoshifumi Uchita, Masaya Kakimoto | 2019-03-26 |