Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10485102 | Substrate for high-frequency printed wiring board | Masaaki Yamauchi, Kentaro Okamoto, Satoshi KIYA, Kazuo Murata | 2019-11-19 |
| 10244626 | Adhesive composition for printed wiring boards, bonding film, coverlay, copper-clad laminate and printed wiring board | Takayuki Yonezawa, Jun Sugawara, Shogo Asai, Yoshifumi Uchita, Masaya Kakimoto | 2019-03-26 |