Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10418340 | Semiconductor chip mounted on a packaging substrate | Makoto Murai, Kazuki Sato, Hiroyuki Yamada | 2019-09-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10418340 | Semiconductor chip mounted on a packaging substrate | Makoto Murai, Kazuki Sato, Hiroyuki Yamada | 2019-09-17 |