Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10418340 | Semiconductor chip mounted on a packaging substrate | Yuji Takaoka, Kazuki Sato, Hiroyuki Yamada | 2019-09-17 |
| 10300475 | Circumferential coating material and circumferential coating honeycomb structure | Shuji Ueda, Shungo NAGAI, Takayoshi Shibayama, Yoshihiro Sato, Kojiro Hayashi | 2019-05-28 |