Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522617 | Integrated RF front end system | Mark M. Doherty | 2019-12-31 |
| 10447210 | Flip chip amplifier for wireless device | Bharatjeet Singh Gill | 2019-10-15 |
| 10263072 | Integrated RF front end system | Mark M. Doherty | 2019-04-16 |
| 10211197 | Fabrication of radio-frequency devices with amplifier voltage limiting features | Anthony Francis Quaglietta | 2019-02-19 |
| 10193504 | Solder bump placement for thermal management in flip chip amplifiers | Bharatjeet Singh Gill | 2019-01-29 |
| 10181824 | Solder bump placement for grounding in flip chip amplifiers | Bharatjeet Singh Gill | 2019-01-15 |
| 10177716 | Solder bump placement for emitter-ballasting in flip chip amplifiers | Bharatjeet Singh Gill | 2019-01-08 |