Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10447210 | Flip chip amplifier for wireless device | Michael Joseph McPartlin | 2019-10-15 |
| 10193504 | Solder bump placement for thermal management in flip chip amplifiers | Michael Joseph McPartlin | 2019-01-29 |
| 10181824 | Solder bump placement for grounding in flip chip amplifiers | Michael Joseph McPartlin | 2019-01-15 |
| 10177716 | Solder bump placement for emitter-ballasting in flip chip amplifiers | Michael Joseph McPartlin | 2019-01-08 |