Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10347576 | Package substrate and semiconductor package including the same | Kwang Won Choi, Sang-Woo Pae, Seong Won JEONG, Min Jae Kwon, Da-Hye Min +1 more | 2019-07-09 |
| 10304684 | Semiconductor device having buried gate structure and method for fabricating the same | Tae Su Jang, Ji Hwan Park, Il-Sik Jang, Seong-Wan Ryu, Se In KWON +2 more | 2019-05-28 |