Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10347576 | Package substrate and semiconductor package including the same | Kwang Won Choi, Sang-Woo Pae, Seong Won JEONG, Min Jae Kwon, Jin-Chul Park +1 more | 2019-07-09 |
DM
Da-Hye Min
Overall (2019): #494,108 of 560,194Top 90%
1
Patents 2019