Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10312135 | Combined wafer production method with laser treatment and temperature-induced stresses | Jan Richter, Christian Beyer | 2019-06-04 |
| 10304738 | Method and device for the production of wafers with a pre-defined break initiation point | Lukas Lichtensteiger | 2019-05-28 |
| 10269643 | Method and device for the production of wafers with a pre-defined break initiation point | Lukas Lichtensteiger | 2019-04-23 |
| 10229835 | Splitting method and use of a material in a splitting method | Jan Richter, Christian Beyer | 2019-03-12 |