Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10312135 | Combined wafer production method with laser treatment and temperature-induced stresses | Wolfram Drescher, Jan Richter | 2019-06-04 |
| 10280107 | Method for guiding a crack in the peripheral region of a donor substrate | Marko Swoboda, Franz Schilling, Jan Richter | 2019-05-07 |
| 10229835 | Splitting method and use of a material in a splitting method | Wolfram Drescher, Jan Richter | 2019-03-12 |