Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10513605 | Halogen-free epoxy resin composition, prepreg, laminate and printed circuit board containing the same | Hui Li, Kehong Fang | 2019-12-24 |
| 10513608 | Process for preparing resin composition comprising benzoxazine, prepreg and laminate prepared therefrom | Long Xi, Jiang Li | 2019-12-24 |
| 10494502 | Halogen-free thermosetting resin composition, prepreg, laminate and printed circuit board comprising the same | Jiang You, Tianhui HUANG, Zhongqiang Yang | 2019-12-03 |
| 10400173 | Siloxane-modified cyclotriphosphazene halogen-free flame retardant, preparation process and use thereof | Yongzhen Wang, Yueshan He, Zhongqiang Yang | 2019-09-03 |
| 10400099 | Halogen-free epoxy resin composition, prepreg, laminate and printed circuit board containing the same | Hui Li, Kehong Fang | 2019-09-03 |
| 10240074 | Degradable and recyclable epoxy conductive adhesive as well as preparing, degrading and recycling methods therefor | Zengbiao Huang, Huayang Deng | 2019-03-26 |
| 10208156 | Epoxy resin composition, prepreg and laminate using same | Xianping Zeng, Liexiang He | 2019-02-19 |