Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10400058 | Degradable resin composition, and prepreg, laminate and copper clad laminate using same, and degrading method thereof | Zengbiao Huang, Qianfa Liu, Zhongqiang Yang, Peng Wang | 2019-09-03 |
| 10240074 | Degradable and recyclable epoxy conductive adhesive as well as preparing, degrading and recycling methods therefor | Zengbiao Huang, Yongjing XU | 2019-03-26 |