Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10500680 | Solder alloy, solder ball, and solder joint | Ken Tachibana, Hikaru Nomura, Yuki Iijima, Takashi Saito, Takahiro Yokoyama +1 more | 2019-12-10 |
| 10350712 | Solder paste | Motoki Koroki, Sakie Okada, Taro Itoyama, Hideyuki KOMURO, Naoko Hirai +1 more | 2019-07-16 |
| 10343238 | Lead-free solder alloy | Masayuki Suzuki, Naoko IZUMITA, Ken Tachibana, Rei Fujimaki, Hikaru Nomura | 2019-07-09 |
| 10213879 | Solder alloy | Hikaru Nomura | 2019-02-26 |