Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10500680 | Solder alloy, solder ball, and solder joint | Hikaru Nomura, Yuki Iijima, Takashi Saito, Takahiro Yokoyama, Shunsaku Yoshikawa +1 more | 2019-12-10 |
| 10434608 | Lead-free solder, lead-free solder ball, solder joint using the lead-free solder and semiconductor circuit having the solder joint | Yuya Nagasawa | 2019-10-08 |
| 10343238 | Lead-free solder alloy | Masayuki Suzuki, Naoko IZUMITA, Shunsaku Yoshikawa, Rei Fujimaki, Hikaru Nomura | 2019-07-09 |